Huawei Kirin 820 details have been spotted online and it seems that the new SoC is for low-cost phones. The new platform will follow Kirin 810, 7nm platform for mid-range smartphones.
The Kirin 820 will be manufactured using the 6nm process technology. Thanks to new manufacturing process, the density of transistors will increase by 18%, which will affect the performance for the better compared to the chipsets from Qualcomm and MediaTek.
Most likely, the Kirin 820 will receive Cortex A77 cores, as well as a dual-mode 5G modem. It is said that HiSilicon has already started working on the Kirin 820 chipset, but serial production of the processor should begin in the second quarter of this year. And the announcement should be expected in the summer.