Samsung has reportedly developed a new cooling technology for its upcoming Exynos 2600 chipset, which has already shown impressive results on Geekbench and 3DMark benchmarks. The innovative solution, known as Heat Pass Block (HPB), promises to improve thermal management of the application processor more effectively than previous cooling approaches.
The HPB technology adds a copper heat sink layer directly to the chipset stack, placing it closer to the heat source than traditional heat spreaders. While conventional heat spreaders are added after the package-on-package structure is assembled, the HPB is integrated within the stack itself, allowing for more efficient heat dissipation from the CPU, GPU, and NPU components.
The Exynos 2600 will be manufactured using Samsung’s advanced 2nm Gate-All-Around (GAA) process technology and is expected to power the Galaxy S26 series. Industry analysts suggest that some or all Galaxy S26 Ultra models may utilize a Snapdragon chip instead, while the distribution of chipsets across other S26 models and markets remains to be determined.
Samsung is anticipated to complete quality testing of the Exynos 2600 soon, with an official unveiling expected in the coming months. The Galaxy S26 series is scheduled for release in late January or early February, marking the debut of this new chipset with its innovative cooling solution.
