The new Apple AirPods 3 might have a similar design with AirPods Pro
According to the well-known analyst Ming-Chi Kuo from TF Securities, the next-generation Apple AirPods headset will switch to a more sophisticated chip layout solution – a “system-in-package” (SiP), which will replace surface mount technology (SMT) used in current versions of the device.
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Compared to SMT technology, SiP systems typically allow manufacturers to pack more components in less physical space. For example, Apple AirPods Pro uses a SiP design with an H1 chip developed by Apple that processes audio, Siri commands, noise reduction capabilities, and more.
Entry level earphones are on the way
According to analysts, the technology giant from Cupertino will use SiP in its entry-level AirPods for the first time in 2021. What exactly this will give end users is unclear, although one can expect the appearance in AirPods 3 of more advanced features used by owners of the Pro version.
Mr. Kuo said in a note that the design of the new wireless headphones will be closer to AirPods Pro, and SiP technology was probably needed in order to miniaturize the device.
The analyst noted that AirPods 3 should enter the market in the first half of 2021, and suppliers of components of the current generation of AirPods Pro can count on an increase in the supply of their products by 50-100% year on year.
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AirPods sales will slow down
Amkor, JCET, a potential newcomer to Huanxu Electronics, a manufacturer of AirPods hinges in the form of Shin Zu Shing, battery suppliers Varta and Sunwoda Electronic, as well as collectors in the face of Goertek and Luxshare, are projected to benefit from the switch to SiP technology.
Despite the new design of AirPods 3, it is expected that in 2021 the overall growth in the supply of AirPods headsets will slow down a little – it will be 28% compared to 2020. This year, the growth rate is expected to be 65.1% compared to 2019, largely due to Apple’s refusal to equip the iPhone 12 with EarPods.