Huawei discloses a patent for “chip and its preparation method” which can improve chip strength and solve cracks.
Huawei Technologies Co. Ltd. disclose a “chip and its preparation method, electronic devices” patent, the disclosure number CN112309991A the patent abstract shows that this application provides a chip and its preparation method, electronic devices, involving the chip technology field, for solving the problem of cracks on the bare chip, resulting in bare chip failure.
Huawei publishes a patent that can improve chip strengthAccording to the patent application information, the core component of the electronic system is the bare chip, and the stability of the bare chip structure determines the stability of the electronic system. However, in the prior art, when preparing bare chips or packaging bare chips, it is easy to crack between the film layer and the film layer in the bare chips or break the film layer after being subjected to heat or pressure, failing the bare chips.
To avoid this, the chip will be designed to contain both functional and non-functional areas. The non-functional area has a first reinforcement that will extend and block the crack. At the same time, the thermal stress can be reduced by 30%, reducing the probability of cracks.
