AMD would implement a 3D Stacking design to increase CPU performance.
The Japanese tech site Nikkei revealed that TSMC is working closely with AMD, Google and other major companies to develop a new way to make processors more powerful. This would be made possible by 3D Stacking, which, in short, allows the components of a chip to be stacked both vertically and horizontally.
This would allow the creation of much more powerful, small and energy efficient chips, because the processor, memory, sensors and other components could be included in the same silicon. This was called SolC by the company.
TSMC plans to implement its new 3D Stacking technology at a plant it is building in the Taiwanese city of Miaoli. The construction of this new foundry is scheduled to see mass production starting in 2022. This means that so-called Zen 5-based CPUs could include this new technology, allowing them to dramatically increase the total number of cores.
After NVIDIA and Broadcom left TSMC in search of other specialized packaging companies such as ASE Technology Holding, Amkor and Powertech, the Taiwanese company would be redoubling its efforts to keep other big players like Apple, Google or Huawei in their ranks.
“TSMC of course is not trying to replace all the traditional chip packaging players, but it aims to serve those premium customers at the top of the pyramid so that those big chip developers like Apple, Google, AMD and Nvidia do not leave TSMC for their competitors,” said an anonymous source familiar with the issue.
