TSMC will launch its 3nm Plus manufacturing process in 2023, Apple will be the first to implement it. Industry sources have revealed to Digitimes that TSMC already has an improved 3 nm manufacturing process in place, called 3 nm Plus, which is expected to arrive sometime in 2023.
TSMC will launch its 3nm Plus manufacturing process in 2023, Apple will be the first to implement it
While it is not really known when mass production will start, at least it is mentioned that Apple will be the first company to implement this cutting-edge manufacturing process and that Apple is being very aggressive in wanting to always be one step ahead of others, and more so now that it is developing its own processors and graphics for desktops and laptops.
Before that happens, the manufacturing process will first arrive at 3nm FinFET, which will offer a remarkable leap in energy efficiency set at 25 to 30 percent over N5 (5nm), or a 10 to 15 percent performance improvement at the same energy consumption while the logical density increases by 70 percent. It will already be a matter of silicon design. Whether one of the source points of the lithography is exploited or an intermediate point is sought.
Now all that remains is to wait and see what improvements in energy efficiency or performance the leap from 3 nm FinFET to 3 nm Plus entails.
